SILICON & MEMS

MICROMACHINING AND PATTERNING




Laserod specializes in laser machining of silicon (Si). We offer precision laser cutting, scribing, coring (resizing), flat or notch cutting, microdrilling holes, singulation and dicing of silicon and MEMS devices. Typically applications of laser machining silicon include the manufacture of MEMS devices, sensors, detectors, and solar cells.
Silicon is brittle, has a crystalline structure, and has a high vaporization temperature, none of which present a problem to laser machining. For example crystalline direction is of no hindrance to the laser. Also lasers can cut in circles and produce flats or notches all in one operation. Lasers cut circles of almost any size so coring (resizing), and via hole drilling are easily done using pure laser energy with no mechanical contact.

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